OVERVIEW

Both the aspects related to heat transfer in mechatronic systems and the conditioning of the data centers will be presented during the course. New cooling techniques (jet impingement, heat pipes) as well as new heat transfer fluid (nanofluids and PCMs) will be discussed. The measurement techniques for thermal  quantities will also be presented.

AIMS AND CONTENT

LEARNING OUTCOMES

The module aims to provide analytical and numerical tools to address the thermal design of mechatronic systems, as well as to know the most appropriate thermal measurement methods for these systems.

TEACHING METHODS

Lessons and numerical applications

SYLLABUS/CONTENT

Heat transfer (conduction, radiation convection). Performance of finned surfaces. Numerical techniques applied to thermal exchange problems. Design of Compact Heat Exchangers (CHE). Heat pipes and jet impingement. HVAC design of  data centers. Nanofluids and phase-passing materials (PCMs). Thermal and fluid measurements.

RECOMMENDED READING/BIBLIOGRAPHY

M. Misale: Schede del corso "PROGETTAZIONE TERMICA DI SISTEMI MECCATRONICI", 2017 (Aulaweb)

Y. A. Cengel, Termodinamica e trasmissione del calore, McGraw-Hill

M. J. Moran, H. N. Shapiro, B. R. Muson, D. P. DeWitt, Elementi di Fisica tecnica per l'ingegneria, McGraw-Hill

A. Bejan: Heat Transfer, J. Wiley & Sons

M. Iyengar, K.J.L. Geisler, B. Sammakia, Cooling of microelectronic and nanoelectronic equipment, WSP

C. C.  Silverstein, Design and Technology of heat pipes for cooling and heat exchange, Hemishpere Publishing Corporation.

S. Kacas, H. Liu, A. Pramuanjaroenkij, Heat exchangers, CRC press

TEACHERS AND EXAM BOARD

Exam Board

EDWARD CANEPA (President)

SILVIA MARELLI (President)

MARIO MISALE (President)

LESSONS

Class schedule

The timetable for this course is available here: Portale EasyAcademy

EXAMS

EXAM DESCRIPTION

The examination will be oral. A written report will also be given by the teacher before the end of the course.

Exam schedule